Metal fusion bonding – With means to remove – compact – or shape applied flux or filler – By fluid blast or suction
Patent
1985-07-19
1987-10-06
Jordan, M.
Metal fusion bonding
With means to remove, compact, or shape applied flux or filler
By fluid blast or suction
228 51, B23K 304
Patent
active
046977295
ABSTRACT:
A replaceable tip for a hand-held pencil-like solder extractor for removing electronic components from a substrate. The tip comprises a tubular member having a first linear section of predetermined length with a first end coaxially receivable within a passageway in a solder extractor, a second linear section of predetermined length and having a free end, and a detent means intermediate the first and second sections for limiting the length of the tubular member received within the solder extractor passageway and for maintaining the free end of the tubular member a fixed distance from the solder extractor. The first and second linear sections each have a respective axis, and the axis of the first section forms an angle with the axis of the second section. A component removal head is connected to the free end of the tubular member, and the head has at least two heatable spaced-apart shoulders for contacting the lead connections of a component to melt the solder at the lead connections, and a suction means connected to the central bore for holding a component between the shoulders upon the application of suction through the central bore to thereby facilitate removal of the component from the substrate upon melting of the solder of the lead connections.
REFERENCES:
patent: 2955187 (1960-10-01), Campo
patent: 3084649 (1963-04-01), Parstorfer
patent: 3382564 (1968-05-01), Gallentine
patent: 3529760 (1970-09-01), Hickman et al.
patent: 3813023 (1974-05-01), Auray et al.
patent: 3896533 (1975-07-01), Ullman et al.
patent: 4269343 (1981-05-01), Siegel et al.
patent: 4528746 (1985-07-01), Yoshimura
Ferguson Jr. Gerald J.
Hoffman Michael P.
Jordan M.
Malamud Ronni S.
Pace Incorporated
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