Tinning system for surface mount components

Coating apparatus – With heat exchange – drying – or non-coating gas or vapor... – To remove or spread applied coating by gas blast

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Details

118 50, 118 74, 118410, B05C 1100

Patent

active

047994509

ABSTRACT:
A method and apparatus for the tinning or hot solder coating of leads of electronic components wherein the components are individually transported through the tinning process by means of a vacuum gripping device and wherein the planarity and thickness of the solder coating is controlled using pressurized gaseous material.

REFERENCES:
patent: 3302803 (1967-02-01), Mooney
patent: 3587816 (1971-06-01), Russell et al.
patent: 3633731 (1972-01-01), Jones
patent: 4570569 (1986-02-01), Kondo

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