Tin-zinc solder connection to a printed circuit board or the lik

Details Tin-zinc solder connection to a printed circuit board or the lik Tin-zinc solder connection to a printed circuit board or the lik

1994-11-07

1995-09-26

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228193, 2282481, H05K 334

Patent

active

054528429

ABSTRACT:
An electronic package comprises a component mounted on a substrate, such as a printed circuit board, by a solder connection that is based upon a tin alloy containing zinc. The connection is formed to copper faying surface on the substrate, and includes a first layer formed of a zinc-free tin metal bonded to the copper surface and a second layer formed of the tin-zinc solder alloy bonded to the first layer. The first layer provides a zinc-free barrier between the copper and the tin-zinc alloy to retard zinc migration to the copper interface that would otherwise result in dezincification of the solder alloy and reduce the mechanical properties of the connection.

REFERENCES:
patent: 4854495 (1989-08-01), Yamamoto et al.
patent: 5024372 (1991-06-01), Altman et al.
patent: 5186381 (1993-02-01), Kim
patent: 5269453 (1993-12-01), Melton et al.
patent: 5346118 (1994-09-01), Degani et al.
Journal of the Electrochemical Society, "Semiconductor Joining by the Solid-Liquid-Interdiffusion (SLID) Process", Leonard Bernstein, vol. 113, No. 12, pp. 1282-1288, Dec., 1966.

Affiliated with

Also associated with

Rating

Tin-zinc solder connection to a printed circuit board or the lik does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Tin-zinc solder connection to a printed circuit board or the lik, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tin-zinc solder connection to a printed circuit board or the lik will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1548434