Tin-zinc solder connection to a printed circuit board of the lik

Details Tin-zinc solder connection to a printed circuit board of the lik Tin-zinc solder connection to a printed circuit board of the lik

1993-05-03

1995-02-14

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361760, 361762, 361792, 361810, 174256, H05K 116

Patent

active

053900804

ABSTRACT:
An electronic package comprises a component mounted on a substrate, such as a printed circuit board, by a solder connection that is based upon a tin alloy containing zinc. The connection is formed to copper faying surface on the substrate, and includes a first layer formed of a zinc-free tin metal bonded to the copper surface and a second layer formed of the tin-zinc solder alloy bonded to the first layer. The first layer provides a zinc-free barrier between the copper and the tin-zinc alloy to retard zinc migration to the copper interface that would otherwise result in dezincification of the solder alloy and reduce the mechanical properties of the connection.

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