Tin whisker-free tin or tin alloy plated article and coating tec

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...

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Details

428646, 428647, 204 373, 204 40, B32B 1500, C25D 510, C25D 550

Patent

active

049592785

ABSTRACT:
A tin or tin alloy plated article, particularly a film carrier which is protected against the generation of tin whiskers characterized in having an indium plated layer on the substrate thereof and a tin or tin alloy plated layer on said indium plated layer. There are also disclosed a coating process therefor as well as a novel and unique electroless indium plating bath therefor, said indium plating bath is an acidic, electroless plating bath characterized by including an indium salt and thiourea or a derivative thereof.

REFERENCES:
patent: 3585010 (1971-06-01), Luce
patent: 3857683 (1974-12-01), Castonguay
patent: 3908075 (1975-09-01), Jackson et al.
patent: 4010005 (1977-03-01), Morisaki et al.
patent: 4255474 (1981-03-01), Smith, Jr.
patent: 4511634 (1985-04-01), Nickol
patent: 4577056 (1986-03-01), Butt
patent: 4640438 (1987-02-01), Trevisson et al.
patent: 4749626 (1988-06-01), Kadija et al.
patent: 4808769 (1989-02-01), Nakano et al.
patent: 4812421 (1989-03-01), Jung et al.
Lyman, J., "Special Report: Film Carriers Star in High-Volume IC Production", Electronics/Dec. 25, 1975, pp. 65-68.
Angelucci, T., "Gang Lead Bonding Integrated Circuits", Solid State Technology/Jul. 1976, pp. 21-25.
Oswald, R. et al., "Automated Tape Carrier Bonding for Hybrids", Solid State Technology/Mar. 1978, pp. 39-48.
Grossman, S., "Film-Carrier Technique Automates the Packaging of IC Chips", Electronics/May 16, 1974, pp. 89-95.
Patent Abstracts of Japan, vol. 3, No. 118 (C-60), 4th Oct. 1979, p. 160, C 60; & JP-A-54 100 941 (Sumitomo Denki Kogyo K.K.) 08-09-1979.
Chemical Abstracts, vol. 80, No. 22, 3rd Jun. 1974, p. 469, Abstract No. 127422w, Columbus, Ohio, U.S.; V. A. Nikolaeva et al.: "Cathodic Deposition of Indium from Sulfate Solutions in the Presence of Thiourea", & Zh. Prikl. Khim (Leningrad), 1974, 47(1), 231-3.

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