Tin-soldering machine with automatic wave barrier for printed ci

Details Tin-soldering machine with automatic wave barrier for printed ci Tin-soldering machine with automatic wave barrier for printed ci

1988-02-29

1989-08-22

Godici, Nicholas P.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

With means to skim dross

228 37, 228 39, 228214, 118410, 118678, H05K 334

Patent

active

048588164

ABSTRACT:
The wave barrier device of the invention comprises a flap which is rigidly joined to the soldering machine. This flap plunges lightly into the molten tin bath and pushes it before the board which is precedes.

REFERENCES:
patent: 3379356 (1968-04-01), Eith
patent: 3445919 (1969-05-01), Saba
patent: 3506478 (1970-04-01), Hudson et al.
patent: 3532262 (1970-10-01), Laubmeyer et al.
patent: 3705457 (1972-12-01), Tardoskegyi
patent: 4027607 (1977-06-01), Pan et al.
Patent Abstracts of Japan, vol. 9, No. 94 (M-374) (1817) Apr. 24, 1985, JP-A-59 220 278 (Jiyapab Fuirudo K.K.) 11-12-1984.
Patent Abstracts of Japan, vol. 10, No. 273 (M-518) (2329), Sep. 17, 1986, & JP-A-61 95 768 (Kojima Press Co. Ltd.) 14-05-1986.

Affiliated with

Also associated with

Rating

Tin-soldering machine with automatic wave barrier for printed ci does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Tin-soldering machine with automatic wave barrier for printed ci, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tin-soldering machine with automatic wave barrier for printed ci will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2414001