Alloys or metallic compositions – Tin base – Antimony – or bismuth containing
Patent
1994-01-05
1995-08-08
Simmons, David A.
Alloys or metallic compositions
Tin base
Antimony, or bismuth containing
148400, C22C 1302
Patent
active
054396395
ABSTRACT:
A lead-free solder alloy for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0<x<5 percent by weight based on the weight of tin effective to depress the melting point of the tin-silver composition to a desired level. Melting point ranges from about 218.degree. C. down to about 205.degree. C. depending an the amount of bismuth added to the eutectic tin-silver alloy as determined by DSC analysis, 10.degree. C./min. A preferred alloy composition is 91.84Sn-3.33Ag-4.83Bi (weight percent based on total alloy weight).
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Vianco, Paul T., "An Overview of the Meniscometer/Wetting Balance Technique For Wettability Measurements," The Metal Science of Joining, pp. 265-284, Proceedings, Oct. 20-24, 1991.
Chirino, O. I., et al., "High Creep Strength Alloy", IBM Technical Disclosure Bulletin, vol. 23, No. 8 p. 3620, Jan. 1981.
Vianco, Paul T., and Yost, Frederick G., "A Ban on Use of Lead-Bearing Solders, Implications for the Electronics Industry," Sandia Report, SAND92-0211, UC-904, pp. 1-10, Apr. 1992.
Rejent Jerome A.
Vianco Paul T.
Libman George H.
Sandia Corporation
Simmons David A.
Stanley Timothy D.
Vincent Sean
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