Tin-silver-based soldering alloy

Details Tin-silver-based soldering alloy Tin-silver-based soldering alloy

1997-08-15

1999-09-28

Sheehan, John

Alloys or metallic compositions

Tin base

Antimony, or bismuth containing

420557, 148 22, C22C 1302

Patent

active

059583339

ABSTRACT:
The present invention provides a soldering alloy which does not include harmful Pb or Cd and which has an excellent tensile strength, elongation value, and melting point property. The soldering alloy according to the present invention can thus solve the conventional environmental problems, set the soldering temperature at a low level to thereby restrict the thermal damage to a soldered portion, and prevent breaking of the soldering alloy due to a heat cycle, with an excellent tensile strength and elongation value. A tin-silver-based soldering alloy according to the present invention consist essentially of 3 to 4% by weight of Ag, 2 to 6% by weight of Bi, 2 to 6% by weight of In, and the balance being Sn.

REFERENCES:
patent: 5256370 (1993-10-01), Slattery et al.
patent: 5328660 (1994-07-01), Gonya et al.
patent: 5520752 (1996-05-01), Lucey et al.
patent: 5658528 (1997-08-01), Ninomiya et al.

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