Tin-plated film and method for producing the same

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Treating electrolytic or nonelectrolytic coating after it is...

Reexamination Certificate

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C205S225000, C205S226000, C427S123000, C427S337000, C427S383700, C428S647000, C428S929000

Reexamination Certificate

active

07488408

ABSTRACT:
The present invention has an object to provide a tin-plated film and a method for producing the same, capable of preventing whiskers from being generated and simultaneously preventing the surface of a substrate to be plated, which is not covered with a tin-plated film, from discoloring due to oxidation, by which prevention of whisker generation, suppression of whisker growth, and prevention of discoloring of a substrate to be plated are compatible with simplified operations ensuring excellent productivity. The method is provided with the steps of removing a part of a tin-plated film formed on copper or copper alloy; processing to prevent discoloring of the copper or copper alloy from which the tin-plated film is removed; and applying heat energy to the tin-plated film of the copper or copper alloy which is processed to prevent discoloring.

REFERENCES:
patent: 5384204 (1995-01-01), Yumoto et al.
patent: 5849424 (1998-12-01), Sugawara et al.
patent: 2001/0049027 (2001-12-01), Endo et al.
patent: 2003/0129441 (2003-07-01), Hara et al.
patent: 2005/0109631 (2005-05-01), Kwon et al.
patent: 2005/0269673 (2005-12-01), Sugioka
patent: 57-0145353 (1982-09-01), None
patent: 61-266597 (1986-11-01), None
patent: 05-033187 (1993-02-01), None
patent: 2001-073186 (2001-03-01), None

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