Tin lead process

Coating processes – Immersion or partial immersion – Metal base

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106 122, 106 125, B05D 118, C23C 1816

Patent

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051696924

ABSTRACT:
A process for replenishing a tin-lead alloy displacement plating solution which comprises periodically adding complexing agent to the solution during use of the same to bring the total concentration of complexing agent to an amount sufficient to ensure adhesion of the deposit to its underlying substrate.

REFERENCES:
patent: Re30434 (1980-11-01), Davis
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patent: 4194913 (1980-03-01), Davis
patent: 4234631 (1980-11-01), Davis
patent: 4715894 (1987-12-01), Holtzman et al.
patent: 4816070 (1989-03-01), Holtzman et al.
patent: 4822202 (1989-11-01), Holtzman et al.
Clark, "Handbook of Printed Circuit Manufacturing", Appendix F, 1985, Van Nostrand Rheinhold Co.

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