Tin, lead, or tin-lead alloy plating bath

Details Tin, lead, or tin-lead alloy plating bath Tin, lead, or tin-lead alloy plating bath

1986-02-21

1987-06-16

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 53, 204 541, C25D 332, C25D 336, C25D 356, C25D 360

Patent

active

046734708

ABSTRACT:
A tin, lead, or tin-lead alloy plating bath comprising, as essential ingredients, an alkali metal salt, and a soluble divalent tin compound or/and a lead compound, all of an aliphatic or aromatic sulfocarboxylic acid of the general formula ##STR1## wherein R is a C.sub.1-4 hydrocarbon radical, M.sub.1 is a hydrogen atom or alkali metal atom, M.sub.2 is an alkali metal atom, and X.sub.1 and X.sub.2 are each a hydrogen atom, OH, COON, or SO.sub.3 N (where N represents a hydrogen atom or alkali metal atom).

REFERENCES:
patent: 3905878 (1975-09-01), Dohi et al.
patent: 4132610 (1979-01-01), Dohi et al.
patent: 4459185 (1984-07-01), Obata et al.
patent: 4555314 (1985-11-01), Obata et al.

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