Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal or alloy coating on...
Patent
1996-08-21
1998-05-12
Phasge, Arun S.
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Depositing predominantly single metal or alloy coating on...
205104, 205254, 205302, 205303, C25D 518
Patent
active
057500177
ABSTRACT:
A process for plating tin or tin alloy onto metal substrates is described. In the process, a metal substrate is placed in an electroplating bath that contains a stannous sulfate and an organic compound additive in which the organic compound has a heterocyclic moiety in an aqueous solution of sulfonic acid. The bath is then subjected to pulse plating conditions that plate a layer of tin or tin alloy onto the metal substrate wherein the tin in the tin layer has a grain size of about 2 .mu.m to about 8 .mu.m. During pulse plating, a current density of about 65 ASF to about 250 ASF is applied to the electroplating bath in a pulsed manner, i.e. the current is cycled on and off during plating. The duty cycle of the pulse is about twenty-five percent to about thirty percent. The duration of the on pulse during the cycle is about 50 .mu.s to about 500 .mu.s.
REFERENCES:
patent: 3634212 (1972-01-01), Valayil et al.
patent: 4263106 (1981-04-01), Kohl
patent: 4923576 (1990-05-01), Kroll et al.
patent: 5066367 (1991-11-01), Nobel et al.
patent: 5110423 (1992-05-01), Little et al.
"An Alternative Surface Finish for Tin/Lead Solders--Pure Tin", by Zhang, Y. and Abys, J., SUR-FIN '96 International Technical Conference Proceedings, Cleveland, Ohio, pp. 223-245 (Jun. 10, 1996).
"An Overview of Pulse Plating", by Osero, N. M., Plating and Surface Finishing, (Mar. 1986).
"Tin Whiskers: A Case Study", by McDowell, M. E. Captain, USAF, Los Angeles Air Force Base, pp. 207-215. no date available.
"Microstructural Characterization of Electrodeposited Tin Layer", by Selcuker, A. et al., Vitramon, Inc. Box 544, Bridgeport, CT., pp. 19-22. no date available.
"Hot Air Leveled Tin: Solderability and Some Related Properties", by Haimovich, J., 1989 Proceedings for 39th Electronic Components Conference, pp. 107-112 (May 1989).
"Grain Size Effect of Electro-Plated Tin Coatings on Whisker Growth", by Kakeshita, T. et al., Journal of Materials Science 17 pp. 2560-2566 (1982). (no month available).
Botos Richard J.
Lucent Technologies - Inc.
Mayekar Kishor
Phasge Arun S,.
LandOfFree
Tin electroplating process does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Tin electroplating process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tin electroplating process will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-976323