Tin electrolytic plating solution for electronic parts,...

Details Tin electrolytic plating solution for electronic parts,... Tin electrolytic plating solution for electronic parts,...

2008-07-31

2011-12-27

Wong, Edna (Department: 1759)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly single metal coating

C205S300000, C205S302000, C106S001250

Reexamination Certificate

active

08083922

ABSTRACT:
A tin electrolytic plating solution comprises a suitably selected nonionic surfactant having a branched alkyl group. The nonionic surfactant is contained either alone, or with a suitably selected cationic surfactant and/or a suitably selected alkyl imidazole. The invention also provides a tin electrolytic plating method using such a tin electrolytic plating solution, and a tin electroplated electronic part obtained by such a method.

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