Tin deposition

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal coating

Reexamination Certificate

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Details

C205S300000, C205S123000, C205S157000

Reexamination Certificate

active

10685659

ABSTRACT:
A device includes an integrated circuit and a deposited tin in electrical contact with a portion of the integrated circuit. The deposited tin is formed by electrodeposition from a bath. The deposited tin includes a residue characteristic of the bath. The bath includes a bath-soluble tin compound, a strong acid, and a sulfopropylated anionic surfactant. In another aspect, a composition includes between approximately 20 and 40 grams per liter of one of stannous methane sulfonate, stannous sulfate, and a mixture thereof, between approximately 100 and 200 grams per liter of one of methanesulfonic acid, sulfuric acid, and a mixture thereof, and between approximately 1 and 2 grams per liter of one or more polyethyleneglycol alkyl-3-sulfopropyl diethers. In another aspect, a method includes electroplating tin with a current density of greater than approximately 30 mA/cm2 and a plating efficiency of greater than approximately 95%.

REFERENCES:
patent: 4820388 (1989-04-01), Kurze et al.
patent: 5174887 (1992-12-01), Federman et al.
patent: 5492863 (1996-02-01), Higgins, III
patent: 5698087 (1997-12-01), Bokisa
patent: 5750017 (1998-05-01), Zhang
patent: 6322686 (2001-11-01), Brown et al.
patent: 6342148 (2002-01-01), Chiu et al.
patent: 6982191 (2006-01-01), Larson

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