Tin bismuth solder paste, and method using paste to form connect

Details Tin bismuth solder paste, and method using paste to form connect Tin bismuth solder paste, and method using paste to form connect

1994-09-09

1995-07-04

Silverberg, Sam

Metal fusion bonding

Process

Plural joints

2282629, B23K 3524

Patent

active

054292921

ABSTRACT:
A solder paste of the type utilized in forming a solder onnectin for a microelectronic package comprises a mixture of compositionally distinct metal powders. The paste comprises a first metal powder formed of tin-bismuth solder alloy. The paste further comprises a second metal powder containing gold or silver. During reflow, the gold or silver alloys with the tin-bismuth solder to increase the melting part and enhance mechanical properties of the product connection.

REFERENCES:
patent: 4170472 (1979-10-01), Olsen
patent: 4236922 (1980-02-01), Michl
patent: 4670217 (1987-02-01), Henson
patent: 4806309 (1989-02-01), Tulman
American Society for Metals, "Soldering", Welding, Braising and Soldering, vol. 6, Metals Handbook, 9th Edition, 1983, pp. 1069 through 1076.
Murphy, Jim, "Tin-Bismuth Alloy Plating, a Fusible Low Temperature Etch Resist for High Aspect Ratio PC Boards", presented at IPC Fall Meeting, Oct. 7, 12, 1990, San Diego, Calif.
Prints, A. et al., Phase Diagrams off Terniary Gold Alloys, The Institute of Metals, London (1990).

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