Tin-bismuth based lead-free solder for copper and copper alloys

Details Tin-bismuth based lead-free solder for copper and copper alloys Tin-bismuth based lead-free solder for copper and copper alloys

1996-12-20

1998-12-22

Ip, Sikyin

Alloys or metallic compositions

Tin base

420562, C22C 1300

Patent

active

058514821

ABSTRACT:
Lead-free alloys for use as solders for copper and copper alloys. In the alloys, tin (Sn) and bismuth are the basic components and either one or both of antimony (Sb) and zinc (Zn) may be added as major elements to yield a low melting temperature alloy, and small quantities of one or more of aluminum (Al), magnesium (Mg) and tellurium (Te) may be added as elements capable of improving a soldering characteristics and properties of alloy. In preferred embodiments, the alloys contain bismuth (Bi) in a range of 1.0-20 wt %, and one or more of antimony (Sb) in the range of 0.1-8.0 wt %, more preferably 0.1-3.0 wt %, zinc (Zn) in a range of 0.01-3.0 wt %, aluminum (Al) in a range of 0.01-3.0 wt %, magnesium (Mg) in a range of 0.01-3.0 wt %, and tellurium (Te) in a range of 0.01-3.0 wt %, the balance being tin (Sn).

REFERENCES:
patent: 3607253 (1971-09-01), Cain et al.

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