Tin based solder alloy containing lead, antimony, and tellurium

Details Tin based solder alloy containing lead, antimony, and tellurium Tin based solder alloy containing lead, antimony, and tellurium

1994-04-28

1996-01-30

Simmons, David A.

Alloys or metallic compositions

Tin base

Lead containing

2282629, C22C 1300

Patent

active

054878683

ABSTRACT:
The invention is a solder alloy which can alleviate the fatigue rupture which occurs at a soldered joint due to a heat cycle. The solder alloy also shows effective use of the addition of Cu. This solder alloy comprises 57 to 65% Sn, 0.1 to 0.5% Sb, 0.002 to 0.05% Te and the balance being lead, wherein all percentages are by weight. The solder alloy of the present invention also supplements the base composition with 0.001 to 0.05% by weight Ga and/or 0.1 to 0.3% by weight Cu.

REFERENCES:
patent: 3793161 (1974-02-01), Manko
patent: 4734256 (1988-03-01), Liebermann et al.
patent: 4869871 (1989-09-01), Kawai et al.
patent: 4937045 (1990-06-01), Silverman
patent: 5308578 (1994-05-01), Wong
Vianco et al Jour. of Metals, Jul. 1993, pp. 14-19.

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