Tin base soldering/brazing material

Details Tin base soldering/brazing material Tin base soldering/brazing material

1997-01-06

1998-10-06

Ip, Sikyin

Metal treatment

Stock

148 22, 420557, 420560, B23K 3566

Patent

active

058171940

ABSTRACT:
A tin base soldering/brazing material contains 0.05 to 1.5 wt. % of P, 0.5 to 5.0 wt. % of Ni, if necessary, 30 wt. % or less of Cu, and/or 10 wt. % or less of Ag, and the balance of Sn and unavoidable impurities, wherein the total amount of Ni, Cu and Ag is 35 wt. % or less. This tin base soldering/brazing material is used as a tin base low melting point brazing material. Further, this tin base soldering/brazing material is used as a tin base lead-free solder wire having a diameter less than 100 .mu.m and pulling strength of the wire higher than a lead-tin solder wire, and a tin base lead-free solder ball having a diameter less than 1,000 .mu.m and a hardness higher than a tin base lead-free solder ball.

REFERENCES:
patent: 5384090 (1995-01-01), Ogashiwa

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