Tin base lead-free solder composition containing bismuth, silver

Details Tin base lead-free solder composition containing bismuth, silver Tin base lead-free solder composition containing bismuth, silver

1988-01-05

1989-02-21

Rutledge, L. Dewayne

Alloys or metallic compositions

Tin base

Antimony, or bismuth containing

420561, C22C 1302

Patent

active

048063096

ABSTRACT:
A lead-free solder composition of approximately 90% to 95% by weight tin, approximately 3% to 5% by weight antimony, approximately 1% to 4.5% by weight bismuth, and approximately 0.1% to 0.5% by weight silver.

REFERENCES:
patent: 3607253 (1971-09-01), Cain et al.
patent: 4670217 (1987-06-01), Henson et al.

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