Tin antimony solder for MOSFET with TiNiAg back metal

Details Tin antimony solder for MOSFET with TiNiAg back metal Tin antimony solder for MOSFET with TiNiAg back metal

2005-05-24

2005-05-24

Stein, Stephen (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S621000, C428S646000, C428S648000, C428S660000, C428S661000, C428S929000, C257S763000, C257S768000, C228S123100, C438S582000, C438S648000

Reexamination Certificate

active

06896976

ABSTRACT:
A semiconductor device is disclosed containing a semiconductor die having a trimetal electrode soldered to a substrate by a Sn—Sb solder.

REFERENCES:
patent: 4480261 (1984-10-01), Hattori et al.
patent: 6376910 (2002-04-01), Munoz et al.
patent: 6704189 (2004-03-01), Yoshii et al.
patent: 54152867 (1979-12-01), None
patent: 10223835 (1998-08-01), None

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