Metal fusion bonding – Process – With protecting of work or filler or applying flux
Reexamination Certificate
2005-01-11
2005-01-11
Stoner, Kiley S. (Department: 1725)
Metal fusion bonding
Process
With protecting of work or filler or applying flux
C228S248100, C228S180220
Reexamination Certificate
active
06840434
ABSTRACT:
One method of the present invention includes applying a paste-like fluxing agent to an aluminum body part; heating the fluxing agent to deoxidize the surface of the aluminum body part; applying a solder filler to the aluminum body part; and heating the solder filler to bond the solder filler to the aluminum body part. The melting point of the solder filler is at least 100 degrees C. lower than the melting point of the aluminum body part. Another method includes forming a filler/flux mixture; applying the filler/flux mixture; and heating the filler/flux mixture to bond the solder filler to the aluminum body part. The disclosed solder fillers include tin-based alloys as follows: (1) 12-22% copper, 3-5% zinc and 75-85% tin; and (2) 3-5% copper, iron, cobalt, or nickel, 12-40% zinc and 55-85% tin and zinc-based solder filler alloys composed of 78-98% zinc and 2-22% aluminum.
REFERENCES:
patent: 900810 (1908-10-01), Wibrin et al.
patent: 941835 (1909-11-01), Wirgovits
patent: 1332899 (1920-03-01), Iversen
patent: 1417348 (1922-05-01), Randall
patent: 1437641 (1922-12-01), Ferriere et al.
patent: 1721814 (1929-07-01), Geisel
patent: 2004372 (1935-06-01), Luschenowsky
patent: 2243278 (1941-05-01), Johnson
patent: 2473886 (1949-06-01), Hull
patent: 2864733 (1958-12-01), Kranich
patent: 3858319 (1975-01-01), Stokes et al.
patent: 3900151 (1975-08-01), Schoer et al.
patent: 4070192 (1978-01-01), Arbib et al.
patent: 4106930 (1978-08-01), Nomaki et al.
patent: 4248905 (1981-02-01), Harvey
patent: 4352450 (1982-10-01), Edgington
patent: 4358884 (1982-11-01), Harvey et al.
patent: 4374904 (1983-02-01), Harvey
patent: 4448748 (1984-05-01), Radtke et al.
patent: 4859544 (1989-08-01), Schwellinger
patent: 4955525 (1990-09-01), Kudo et al.
patent: 5005285 (1991-04-01), Ishii
patent: 5013587 (1991-05-01), Kiilunen et al.
patent: 5094813 (1992-03-01), Kale
patent: 5435968 (1995-07-01), Panthofer
patent: 5806752 (1998-09-01), Van Evans et al.
patent: 5863493 (1999-01-01), Achari et al.
patent: 5871690 (1999-02-01), Achari et al.
patent: 5961853 (1999-10-01), Thornton
patent: 5985212 (1999-11-01), Hwang et al.
patent: 6086687 (2000-07-01), Oud et al.
patent: 6148515 (2000-11-01), Suzuki et al.
patent: 6180055 (2001-01-01), Tetsuro
patent: 6244497 (2001-06-01), Conn et al.
patent: 0 785 045 (1997-07-01), None
patent: 0 965 411 (1999-12-01), None
patent: 2 289 057 (1995-08-01), None
patent: 51-119651 (1976-10-01), None
patent: 54-133449 (1979-10-01), None
patent: 3-35894 (1991-02-01), None
Clay Nigel Frederick
Gickler Alan Edward
LePrevost, Jr. Frederic Hilaire
Pan Tsung-Yu
Brooks & Kushman P.C.
Coppiellie Raymond L.
Ford Motor Company
Johnson Manufacturing Company
Stoner Kiley S.
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