Tin and tin-zinc plated substrates to improve Ni-Zn cell...

Chemistry: electrical current producing apparatus – product – and – Current producing cell – elements – subcombinations and... – Electrode

Reexamination Certificate

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C429S231000, C429S229000, C205S300000, C205S305000

Reexamination Certificate

active

07931988

ABSTRACT:
An improved Ni—Zn cell with a negative electrode substrate plated with tin or tin and zinc during manufacturing has a reduced gassing rate. The copper or brass substrate is electrolytic cleaned, activated, electroplated with a matte surface to a defined thickness range, pasted with zinc oxide electrochemically active material, and baked. The defined plating thickness range of 40-80 μIn maximizes formation of an intermetallic compound Cu3Sn that helps to suppress the copper diffusion from under plating layer to the surface and eliminates formation of an intermetallic compound Cu6Sn5during baking to provide adequate corrosion resistance during battery operation.

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