Tin and gold plating process

Details Tin and gold plating process Tin and gold plating process

1981-10-06

1983-07-19

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 32R, 204 38S, C25D 502, C25D 556

Patent

active

043942237

ABSTRACT:
A process used for plating a substrate in which the etching of the substrate's copper cladding is terminated early leaving a thin layer of copper. Resist material is then selectively placed upon this thin layer of copper in such a manner that will result in those areas of the circuit to be electroplated being connected. Etching is then resumed to completion, resulting in electrical isolation of those portions of the circuit that are not to be electroplated. Gold electroplating followed by electroless tin plating of the remainder of the circuit can then be performed followed by a final etching to remove the electrical shorts.

REFERENCES:
patent: 2695351 (1954-11-01), Beck
patent: 2959525 (1960-11-01), Ritt et al.
patent: 3470043 (1969-09-01), Whitfield
patent: 3554876 (1971-01-01), Keene

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