Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1991-10-25
1992-09-01
Pianalto, Bernard
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 4, 427249, 427254, 4272551, 4272553, 427297, 427325, 427444, B05D 306
Patent
active
051437481
ABSTRACT:
A surface treatment process for improving surface properties of a timber as to wetness by exposing the timber to a plasma mixture of an inert gas and a reactive gas at a near atmospheric pressure. Prior to being exposed to the plasma mixture, the timber is treated to reduce a moisture content below a fiber saturation point of the timber so as to eliminate free moisture from the fibers of the timber which would otherwise lead to unstable plasma and therefore detract an uniform improvement over substantially the entire surface expected at the subsequent exposure to the plasma mixture. Thus, the plasma treatment can be effected in the absence of the free moisture to obtain a desired surface improvement uniformly across the surface of the timber, which gives an enhanced practicability of improving the surface properties of the timber, in addition to that the plasma mixture is generated at near the atmospheric pressures readily available without requiring substantial vacuum generating equipments.
REFERENCES:
patent: 4749440 (1988-06-01), Blackwood et al.
patent: 4863809 (1989-09-01), Brar et al.
Ishikawa Hiroyuki
Kogoma Masuhiro
Okazaki Satiko
Sawada Yasushi
Usui Hiroaki
Kogoma Masuhiro
Matsushita Electric & Works Ltd.
Okazai Satiko
Pianalto Bernard
LandOfFree
Timber surface improving treatment process does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Timber surface improving treatment process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Timber surface improving treatment process will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-766607