Tilted land grid array package and socket, systems, and methods

Details Tilted land grid array package and socket, systems, and methods Tilted land grid array package and socket, systems, and methods

2007-05-22

2007-05-22

Zarroli, Michael C. (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C439S071000

Reexamination Certificate

active

10880149

ABSTRACT:
A electrical interface for an electronic package, using lands on the package which are non-planar with metal layers within the package. This non-planar or tilted land grid array (TLGA) package is assembled with a complementary TLGA socket to make electronic connection to the package.

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“cLGA Land Grid Array Socket System: Product Description”, http://www.lgasockets.com/desc/default.htm, (2003), 3 pages.
Corbin, J. S., et al., “Land grid array sockets for server applications”,IBM J. Res.&Dev.,vol. 46, No. 6, (Nov. 2002), 763-778.

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