Tile-based routing method of a multi-layer circuit board

Details Tile-based routing method of a multi-layer circuit board Tile-based routing method of a multi-layer circuit board

2006-05-16

2006-05-16

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S831000, C029S846000, C174S260000, C174S262000, C438S106000

Reexamination Certificate

active

07043828

ABSTRACT:
A routing method for routing a plurality of signal traces out of a plurality of corresponding bumper pads in a multi-layer circuit board. The multi-layer circuit board includes at least a first layer and a second layer. The method includes arranging the plurality of bumper pads based on a plurality of triangle units, routing a plurality of signal traces out of a plurality of corresponding bumper pads of in the first layer, routing a plurality of signal traces out of a plurality of corresponding bumper pads in the second layer not to be vertically parallel with the plurality of signal traces routed in the first layer, and arranging a plurality of shielding traces among the plurality of signal traces in the first layer and in the second layer.

REFERENCES:
patent: 6225143 (2001-05-01), Rao et al.
patent: 6674166 (2004-01-01), Rao et al.
patent: 6680544 (2004-01-01), Lu et al.
patent: 2004/0255457 (2004-12-01), Fang et al.

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