Tightly-closing housing for an electronic circuit, particularly

Details Tightly-closing housing for an electronic circuit, particularly Tightly-closing housing for an electronic circuit, particularly

1991-05-17

1992-06-02

Nimmo, Morris H.

Electricity: conductors and insulators

With fluids or vacuum

With cooling or fluid feeding, circulating or distributing

361388, 361389, H05K 720

Patent

active

051189038

DESCRIPTION:

BRIEF SUMMARY
BACKGROUND OF THE INVENTION

The invention relates to a housing for an electronic circuit provided with a connection plug, particularly for control device electronics of an internal combustion engine of a vehicle, comprising a frame, to which a printed circuit board with the electronic circuit is fastened, and a heat sink to which the power components of the electronic circuit are assigned, as well as a cover enclosing the printed circuit board.
Housings for electronic circuits which are exposed to environmental influences must close tightly. Costly constructions with sealing inserts are known. An electronic control device with a housing having a cooling frame is known from DE-PS 25 46 334. The cooling frame has a base on which heat-generating components of a power stage are located. The cooling frame requires a metal section of relatively complicated construction. The known version is therefore quite cost-intensive. Since the cooling frame is covered by a hood-like cover, it must be taken into account in the design that the heat losses generated by the power stage are conducted away to such a degree that no impermissible heating occurs.


SUMMARY OF THE INVENTION

In contrast, the invention has the advantage that a tightly closing housing is provided in a very simple, economical construction which has excellent heat dissipating properties for heat-producing components. The frame comprises an injection-molded plastic frame having at least one heat conducting crosspiece of at least one heat sink. The heat conducting crosspiece is embedded in the plastic injection molding process during production so as to ensure a tight construction which is free of gaps. One end of the heat conducting crosspiece passes into a component assembly surface located in the interior of the housing and the other end of the heat conducting crosspiece is constructed as a heat removing element located outside the housing. The heat generated by the components arranged on the component assembly surface is therefore guided out of the housing interior directly via the embedded heat conducting crosspiece, so that excellent cooling properties exist. A heat dissipation is effected outside of the housing by the heat removing element, wherein the component assembly surface, heat conducting crosspiece and heat removing element are preferably constructed so as to form one piece, so that there is extremely low heat transmission resistance. In spite of a tightly closing housing, a particularly effective removal of heat is ensured in this manner. The plastic frame is a particularly simple and economical solution. The heat sink preferably consists of metal.
A double function is taken on by the heat removing element when the latter is simultaneously constructed as a housing fastening connection. Moreover, the heat removing properties are further improved, since the heat transported by the heat conducting web is absorbed or conducted further via the fastening, so that heat accumulations are avoided.
In particular, the housing fastening connection is a flange provided with a bore hole for a fastening element. The heat guided to the flange can therefore be transmitted to a supporting construction or the like via the fastening element. Insofar as the housing receives control device electronics for an internal combustion engine, the heat generated by corresponding power semiconductors is conducted off to the chassis or the body of the motor vehicle via fastening elements constructed e.g. as threaded screws. This leads to outstanding cooling properties. Since the electronic circuit must be connected to supply and data lines, a connection plug is provided. The latter can be secured on the housing in a particularly simple manner if it is formed into the plastic frame. Consequently, both the heat conducting crosspiece of the heat sink and the connection plug are injection molded with plastic during production of the frame. Accordingly, a gap-free transition to the plastic is also ensured in the connection plug.
According to a preferred embodiment of the inve

REFERENCES:
patent: 3869563 (1975-03-01), Ocken, Jr.
patent: 3904262 (1975-09-01), Cutchaw
patent: 4409641 (1983-10-01), Jakob et al.
patent: 4679118 (1987-07-01), Johnson et al.
patent: 4811165 (1989-03-01), Currier et al.
patent: 5019940 (1991-05-01), Clemens
patent: 5045971 (1991-09-01), Ono et al.
patent: 5053923 (1991-10-01), Niemetz

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