Thyristor device with carbon lifetime adjustment implant and...

Semiconductor device manufacturing: process – Making regenerative-type switching device

Reexamination Certificate

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C438S048000, C438S473000

Reexamination Certificate

active

07488626

ABSTRACT:
In a method of fabricating a semiconductor memory device, a thyristor may be formed in a layer of semiconductor material. Carbon may be implanted and annealed in a base-emitter junction region for the thyristor to affect leakage characteristics. The density of the carbon and/or a bombardment energy and/or an anneal therefore may be selected to establish a low-voltage, leakage characteristic for the junction substantially greater than its leakage absent the carbon. In one embodiment, an anneal of the implanted carbon may be performed in common with an activation for other implant regions the semiconductor device.

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S. Lombardo et al., “High Temperature Annealing Effects on the Electrocal Characteristics of C Implanted Si”; J. Appl. Phys. vol. 79, No. 7, pp. 3464-3469, Apr. 1, 1996.
Ibrahim Ban et al., “Effects of Carbon Implantation on Generation Lifetime in Silicon”; Appl. Phys. Lett.; vol. 68, No. 4, pp. 499-501, Jan. 22, 1996.
American Microsemiconductor, “Tunnel Diode and Back Diode Tutorial”; at www.americanmicrosemi.com/tutorials/tunneldiode.htm; Jul. 31, 2003.
Alan Seabaugh; “Silicon-Based Tunnel Diodes and Integrated Circuits”; University of Notre Dame; at www.nd.edu/˜nano/0a1003QFDpaper—v1.pdf; Jul. 31, 2003.

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