Thyristor device with carbon lifetime adjustment implant and...

Active solid-state devices (e.g. – transistors – solid-state diode – Regenerative type switching device – Emitter region feature

Reexamination Certificate

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C257S156000, C257S297000

Reexamination Certificate

active

07075122

ABSTRACT:
In a method of fabricating a semiconductor memory device, a thyristor may be formed in a layer of semiconductor material. Carbon may be implanted and annealed in a base-emitter junction region for the thyristor to affect leakage characteristics. The density of the carbon and/or a bombardment energy and/or an anneal therefore may be selected to establish a low-voltage, leakage characteristic for the junction substantially greater than its leakage absent the carbon. In one embodiment, an anneal of the implanted carbon may be performed in common with an activation for other implant regions the semiconductor device.

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patent: 6229161 (2001-05-01), Nemati et al.
patent: 6462359 (2002-10-01), Nemati et al.
S. Lombardo et al.,High Temperature Annealing Effects on the Electrocal Characteristics of C Implanted Si; J. App. Phys. vol. 79, No. 7, pp. 34643469, Apr. 1, 1996.
Ibrahim Ban et al.;Effects of Carbon Implantation on Generation Lifetime in Silicon; Appl. Phys. Lett.; vol. 68, No. 4, pp. 499-501, Jan. 22, 1996.
American Microsemiconductor;Tunnel Diode and Back Diode Tutorial; at www.americanmicrosemi.com/tutorials/tunneldiode.htm; Jul. 31, 2003.
Alan Seabaugh;Silicon-Based Tunnel Diodes and Integrated Circuits; University of Notre Dame; at http://www.nd.edu/˜nano/Oa1003QFDpaper—v1.pdf; Jul. 31, 2003.

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