Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit
Reexamination Certificate
2000-01-13
2001-03-27
Bradley, Paula (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Distinct contact secured to panel circuit
C174S266000, C439S931000
Reexamination Certificate
active
06206708
ABSTRACT:
TECHNICAL FIELD OF THE INVENTION
The present invention is directed, in general, to an interconnect for an active cooling system and, more specifically, to a device for providing an electrical interconnection through a plate between an electronic device and another associated device.
BACKGROUND OF THE INVENTION
Designers of electronic circuits must incorporate into their designs methods to control heat generated by electronic components in the circuit. Unless controlled, the heat build-up will cause component and circuit failure. Temperature control, therefore, is vital to circuit reliability. The preferred method to controlling temperature is to dissipate the excess heat into the ambient air surrounding the electronic circuit before temperatures rise to a level where damage can occur.
The traditional method to contain temperature build-up is to associate heat generating components with heat dissipation devices, such as heat sinks. The heat dissipation device absorbs heat from the component and provides for a more efficient transfer of excess heat into the surrounding ambient air. In most cases, the heat generating component will be mounted directly to the heat dissipation device to more efficiently remove the excess heat.
Although traditional heat sinking methods can be used successfully in most cases, the problems associated with temperature control have become more pronounced as electronic circuits have become more complex. Such circuit complexity often results in a circuit that requires a larger number of components, which frequently are more powerful and can generate even more heat. The problem is further complicated by the fact that lower profile and more compact electronic systems have become the preferred choice of customers. This means that space must be found in such low profile, compact systems for both the electronic components that make up the circuit as well as the heat dissipation devices that such components require in order to prevent heat related damage. In short, as the power density of circuits has increased, the use of classic finned heat sinks may no longer adequately address the corresponding heat dissipation requirements.
Some of the foregoing problems have been resolved by using active, rather than passive, systems to control temperature build up. For example, certain board mounted electronic components that generate large amounts of heat can have an active cooling device, such as a small fan, dedicated solely to the device. In those situations where a fan is used as the active device, the fan is typically mounted directly on the component and improves cooling by moving more ambient air over the component. Using a fan in this manner will provide more efficient cooling in less space than a classic finned heat sink.
Notwithstanding the benefits of having an active cooling device associated directly with a heat generating component, active cooling devices have certain shortcomings. One shortcoming is that such a device requires its own power source in order to operate. Prior art methods of providing this power usually involved the provision of a separate wiring path for the active device. Such a path may be provided by using separate connector pins on the substrate that are directly connected to the active device. This solution to the power problem raises additional problems, such as the added manufacturing expense of connecting the active device to an electrical power source during the assembly process. Other detrimental factors may arise when the active device must be removed for replacement or maintenance. Usually the active device must be manually disconnected and, when reinstalled, manually reconnected. This increases maintenance time and the potential for error.
Accordingly, what is needed in the art is a device that can provide electrical power to an active cooling device mounted on an electronic device that does not require a separately wired circuit.
SUMMARY OF THE INVENTION
To address the above-discussed deficiencies of the prior art, the present invention provides an electrical connector for use with a plate having a via located therethrough that is configured to transfer an electrical signal from one major surface of the plate to the other major surface of the plate. In one embodiment, the electrical connector is comprised of a dielectric layer coating a peripheral wall of the via and extending therefrom to coat portions of the opposing major surfaces of the plate adjacent the via. The electrical connector is further comprised of a conductive contact layer that covers a portion of the dielectric layer and extends to portions of the opposing major surfaces to form opposing contacts thereon.
The present invention, in broad scope, introduces an electrical connector that can be used to receive an electrical signal from an electronic device coupled to one side of a plate and transfer that electrical signal to another electronic device coupled to the other side of the plate. For example, the present invention can be used to electrically interconnect a board mounted power device and an active cooling device where the baseplate of the active cooling device is mounted on top of the power device. The electrical interconnect can be used for a number of purposes, such as furnishing operating power to the active cooling device or providing a feedback signal from the cooling device to the board mounted power device.
One embodiment of the invention provides for the electrical connector to have a copper layer as the conductive contact layer covering the dielectric layer. Of course, any material used as a conductive layer covering the dielectric layer will be within the scope of the present invention.
A particularly useful embodiment of the invention provides for the electrical connector to be located proximate a plurality of other electrical connectors that extend through other vias in the plate. This is particularly advantageous where certain connectors are used to transfer power, perhaps of different voltages, through the plate while other connectors are used to furnish other information, such as temperature or air velocity.
In one embodiment of the invention, the electrical connector is formed through a via of a base plate for a board mounted power supply. In another aspect of this embodiment, the board mounted power supply has an output that is electrically connected to the electrical connector.
In still another embodiment, the invention provides for an active cooling device that is couplable to the plate. An aspect of this embodiment provides for the active cooling device to further include a spring contact that provides electrical connectivity with the electrical connector.
The foregoing has outlined, rather broadly, preferred and alternative features of the present invention so that those skilled in the art may better understand the detailed description of the invention that follows. Additional features of the invention will be described hereinafter that form the subject of the claims of the invention. Those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiment as a basis for designing or modifying other structures for carrying out the same purposes of the present invention. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the invention in its broadest form.
REFERENCES:
patent: Re. 29784 (1978-09-01), Chadwick et al.
patent: 3934334 (1976-01-01), Hanni
patent: 3934335 (1976-01-01), Nelson
patent: 4894271 (1990-01-01), Hani et al.
patent: 5374788 (1994-12-01), Endoh et al.
patent: 5414224 (1995-05-01), Adasko et al.
patent: 5590460 (1997-01-01), DiStefano et al.
patent: 5835350 (1998-11-01), Stevens
U.S. Patent Application Serial No. 09/482,839 filed on Jan. 13, 2000 entitled “Integrated Active Cooling Device for Board Mounted Electronic Components” by Shiaw-Jong S. Chen, et al.
Chen Shiaw-Jong S.
Hooey Roger J.
Radke Robert E.
Bradley Paula
Lucent Technologies - Inc.
Ta Tho D.
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