Through the wafer optical transmission sensor

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250341, H01L 21306

Patent

active

051665255

ABSTRACT:
A device for the optical measurement of light transmitted through silicon wafers and other media during the manufacture of electronic components and particularly during processing within a spray environment. The device is characterized by being a stationary assembly designed to provide structurally inherent optical alignment and focus. In addition the device is provided with a geometry specifically designed to direct any condensate flow away from the surface of the wafer, and with surface characteristics which minimize droplet separation from the surface of the device within a spray environment. The device is designed to permit its location out of the main spray pattern. The light source of the device is made as small as possible to minimize intrusion into the process environment.

REFERENCES:
patent: 3475242 (1969-10-01), Radimer
patent: 4569717 (1986-02-01), Ohgami et al.
patent: 4767495 (1988-08-01), Nishioka
patent: 4851311 (1989-07-01), Millis et al.
patent: 5032217 (1991-07-01), Tanaka

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