Through the lead soldering

Details Through the lead soldering Through the lead soldering

1989-10-30

1990-11-27

Godici, Nicholas P.

Metal fusion bonding

Process

Plural joints

228248, 228258, 2281802, 156145, B23K 120, B23K 3102, B23K10136

Patent

active

049729896

ABSTRACT:
A method of joining surface mount components includes screen printing a single layer of solder paste or other adhesive onto a substrate, positioning a component with a planar lead with a hole through the planar lead over the solder and mounting a second component over the hole in the first lead. The assembly is heated or otherwise processed until the solder or adhesive flows by capillary action through the hole and into the space between the components such that it forms solder joint between the stacked components.

REFERENCES:
patent: 3294951 (1966-12-01), Olson
patent: 3566008 (1971-02-01), Ettlinger et al.
patent: 3926360 (1975-12-01), Moister, Jr.
patent: 4835344 (1989-05-01), Iyogi et al.
patent: 4889275 (1989-12-01), Mullen, III et al.

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