Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2011-01-11
2011-01-11
Banks, Derris H (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C174S262000
Reexamination Certificate
active
07866038
ABSTRACT:
A through substrate which comprises a silicon substrate (10) having a through hole (19) penetrating a front surface (11) and a back surface (12), a oxidized silicon film (13) being provided along the inner wall surface of the through hole (19), layers (14, 15) comprising Zn and Cu, respectively, being formed on the inner wall surface of the oxidized silicon film (13), and a Cu plating layer (18) which has been grown from a Cu seed layer (17) along the inner wall surface of layers (14, 15) comprising Zn and Cu, respectively, via an insulating layer (16) between them. The above through substrate can provide a through electrode capable of avoiding the noise due to the cross talk.
REFERENCES:
patent: 5003273 (1991-03-01), Oppenberg
patent: 5286926 (1994-02-01), Kimura et al.
patent: 6221758 (2001-04-01), Liu et al.
patent: 6268660 (2001-07-01), Dhong et al.
patent: 6418615 (2002-07-01), Rokugawa et al.
patent: 6617681 (2003-09-01), Bohr
patent: 6848177 (2005-02-01), Swan et al.
patent: 7033934 (2006-04-01), Iijima et al.
patent: 7217888 (2007-05-01), Sunohara et al.
patent: 2002/0017399 (2002-02-01), Chang et al.
patent: 2003/0085471 (2003-05-01), Iijima et al.
patent: 2003/0200654 (2003-10-01), Omote et al.
patent: 2003/0207566 (2003-11-01), Forbes et al.
patent: 2005/0251997 (2005-11-01), Homg et al.
patent: 1358331 (2000-05-01), None
patent: 0 926 931 (1999-06-01), None
patent: 1 415 950 (2004-05-01), None
patent: 11163192 (1999-06-01), None
patent: 2000-151114 (2000-05-01), None
patent: 2001-352017 (2001-12-01), None
patent: 2002-9193 (2002-01-01), None
patent: 2002-176101 (2002-06-01), None
patent: 2003-513451 (2003-04-01), None
patent: 2004-63725 (2004-02-01), None
patent: 2004-119606 (2004-04-01), None
patent: 2004-128006 (2004-04-01), None
patent: 2004-146445 (2004-05-01), None
patent: 2006-19455 (2006-01-01), None
patent: 2003-0038445 (2003-05-01), None
patent: WO 02/078087 (2002-10-01), None
European Search Report dated Feb. 24, 2009.
European Search Report.
Hoshino Tomohisa
Kagawa Kenichi
Yakabe Masami
Banks Derris H
Carley Jeffrey
Finnegan Henderson Farabow Garrett & Dunner LLP
Tokyo Electron Limited
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