Through silicon via chip stack package capable of...

Details Through silicon via chip stack package capable of... Through silicon via chip stack package capable of...

2007-07-13

2008-11-04

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S723000, C438S405000

Reexamination Certificate

active

07446420

ABSTRACT:
A through silicon via chip stack package includes a substrate; a plurality of chips stacked over the substrate and provided with chip selection pads, through silicon vias and rewirings connecting the chip selection pad and the through silicon via respectively, the through silicon via being connected to one another; and outside connection terminals attached to a lower surface of the substrate, wherein the rewirings in each of stacked chips are formed so as to have connection structures between the chip selection pads and the through silicon vias which are different from one another in each of the chips.

REFERENCES:
patent: 5502333 (1996-03-01), Bertin et al.
patent: 6624506 (2003-09-01), Sasaki et al.
patent: 1020030050665 (2003-06-01), None
patent: 1020050120280 (2005-12-01), None

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