Through-hole plating

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

Patent

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Details

156668, 427 98, 427306, 427307, H05K 342, H05K 346

Patent

active

045158290

ABSTRACT:
Compositions and process for the plating of through-holes in an epoxy printed circuit board base material in the manufacture of printed circuit boards. The treatment process is designed to increase adhesion between the epoxy board material and a subsequently deposited metal plate. The process is characterized, in part, by the use of an activated permanganate solution.

REFERENCES:
patent: 4054693 (1977-10-01), Leech
patent: 4425380 (1984-01-01), Nuzzi

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