Through-hole pin for laminated circuit substrates and method of

Details Through-hole pin for laminated circuit substrates and method of Through-hole pin for laminated circuit substrates and method of

1984-02-07

1985-12-31

Grimley, A. T.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

29829, 29845, 361414, H05K 114, H05K 300

Patent

active

045623015

ABSTRACT:
A through-hole pin connection for laminated circuit elements and method of connection are presented. The laminated circuit element consists of a plurality of individual circuit elements, each element having a land area about the periphery of the through-hole. The through-hole pin has at least one ridged region located along the direction of insertion into the through-hole. Upon insertion, the pin guides a solder into the land areas and the ridged region effects electrical and mechanical contact between the through-hole pin and each of the land areas of the laminated circuit element.

REFERENCES:
patent: 3792412 (1974-02-01), Madden
patent: 4230385 (1980-10-01), Ammon et al.
Lennon et al., IBM Technical Disclosure Bulletin, vol. 21, No. 3, Aug. 1978, pp. 980-981.

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