Inductor devices – With mounting or supporting means
Patent
1997-01-30
1999-12-21
Kozma, Thomas J.
Inductor devices
With mounting or supporting means
336 92, 336 96, 336192, 336229, 361807, 361809, H01F 2702, H01F 2706, H01F 2729
Patent
active
060054638
ABSTRACT:
A device for electrically interconnecting the wire leads of various electronic elements within a microminiature package. A non-conducting base member having a plurality of electronic element barriers and wire lead through-holes is provided. The through-holes are generally located within the interior regions of the base element to minimize potentially detrimental field interactions or capacitive coupling between the leads and the external package terminals. During package assembly, the electronic elements are placed within recesses created within the base member by the aforementioned barriers. These recesses and barriers align the elements and help maintain electrical separation and uniformity during manufacturing. The wire leads from two or more elements are interconnected by twisting them together and inserting them into one of the through-holes. The leads are inserted into the through-holes such that they protrude below the bottom surface of the base element, thereby facilitating soldering of all such connections in a single process step. This arrangement reduces manufacturing and labor costs and increases component and overall package reliability.
REFERENCES:
patent: 2945163 (1960-07-01), Kilby et al.
patent: 3184532 (1965-05-01), Spera
patent: 3845435 (1974-10-01), Georgopulos
patent: 3950269 (1976-04-01), Setterquist
patent: 4084210 (1978-04-01), Forrest
patent: 4188470 (1980-02-01), Collina et al.
patent: 4299936 (1981-11-01), Candlin et al.
patent: 4324691 (1982-04-01), Hartshorn et al.
patent: 4402135 (1983-09-01), Schweingruber et al.
patent: 4415607 (1983-11-01), Denes et al.
patent: 4530914 (1985-07-01), Ewen et al.
patent: 4532152 (1985-07-01), Elarde
patent: 4536484 (1985-08-01), Lacombe et al.
patent: 4540907 (1985-09-01), Hagenlocher et al.
patent: 4591220 (1986-05-01), Impey
patent: 4604799 (1986-08-01), Gurol
patent: 4631639 (1986-12-01), Biraud
patent: 4658078 (1987-04-01), Slaugh et al.
patent: 4665047 (1987-05-01), Slaugh et al.
patent: 4668328 (1987-05-01), Kyytsonen
patent: 4688867 (1987-08-01), Reichardt
patent: 4689103 (1987-08-01), Elarde
patent: 4694572 (1987-09-01), Leber et al.
patent: 4710552 (1987-12-01), Bachl et al.
patent: 4748405 (1988-05-01), Brodzik et al.
patent: 4752597 (1988-06-01), Turner
patent: 4769510 (1988-09-01), Kaminsky et al.
patent: 4791248 (1988-12-01), Oldenettel
patent: 4794096 (1988-12-01), Ewen
patent: 4812950 (1989-03-01), Oyamada
patent: 4814540 (1989-03-01), Watanabe et al.
patent: 4821152 (1989-04-01), Lorenzen
patent: 4870751 (1989-10-01), Antoon
patent: 4871704 (1989-10-01), Kohara et al.
patent: 4886686 (1989-12-01), Muenstedt
patent: 4912075 (1990-03-01), Chang
patent: 4912288 (1990-03-01), Atkinson et al.
patent: 4914253 (1990-04-01), Chang
patent: 4923833 (1990-05-01), Kioka
patent: 4925821 (1990-05-01), Chang
patent: 4931517 (1990-06-01), Fujita
patent: 4933403 (1990-06-01), Kaminsky et al.
patent: 4935397 (1990-06-01), Chang
patent: 4937217 (1990-06-01), Chang
patent: 4937301 (1990-06-01), Chang
patent: 4962248 (1990-10-01), Winter et al.
patent: 4962262 (1990-10-01), Winter et al.
patent: 4985600 (1991-01-01), Heerman
patent: 4996391 (1991-02-01), Schmidt
patent: 5001205 (1991-03-01), Hoel
patent: 5003693 (1991-04-01), Atkinson et al.
patent: 5006500 (1991-04-01), Chang
patent: 5008228 (1991-04-01), Chang
patent: 5008496 (1991-04-01), Schmidt et al.
patent: 5015981 (1991-05-01), Lint et al.
patent: 5023388 (1991-06-01), Luker
patent: 5026797 (1991-06-01), Takahashi
patent: 5042146 (1991-08-01), Watson
patent: 5043515 (1991-08-01), Slaugh et al.
patent: 5055438 (1991-10-01), Canich
patent: 5057475 (1991-10-01), Canich et al.
patent: 5066631 (1991-11-01), Sangokoya et al.
patent: 5086024 (1992-02-01), Crapo et al.
patent: 5086135 (1992-02-01), Kissin
patent: 5087788 (1992-02-01), Wu
patent: 5091352 (1992-02-01), Kioka et al.
patent: 5118903 (1992-06-01), Schupp et al.
patent: 5126303 (1992-06-01), Resconi et al.
patent: 5132262 (1992-07-01), Rieger et al.
patent: 5132381 (1992-07-01), Winter et al.
patent: 5141829 (1992-08-01), Dumas et al.
patent: 5145819 (1992-09-01), Winter et al.
patent: 5147949 (1992-09-01), Chang
patent: 5157008 (1992-10-01), Sangokoya et al.
patent: 5171799 (1992-12-01), Kioka et al.
patent: 5171871 (1992-12-01), Miyashita
patent: 5171919 (1992-12-01), Watanabe et al.
patent: 5176254 (1993-01-01), Caravona
patent: 5178976 (1993-01-01), Rose et al.
patent: 5196496 (1993-03-01), Galimberti et al.
patent: 5198399 (1993-03-01), Hoff et al.
patent: 5206197 (1993-04-01), Campbell, Jr.
patent: 5206199 (1993-04-01), Kioka et al.
patent: 5208304 (1993-05-01), Waymouth
patent: 5216095 (1993-06-01), Dolle et al.
patent: 5223465 (1993-06-01), Ueki et al.
patent: 5225500 (1993-07-01), Elder et al.
patent: 5234878 (1993-08-01), Tsutsui et al.
patent: 5238891 (1993-08-01), Miro
patent: 5238892 (1993-08-01), Chang
patent: 5240894 (1993-08-01), Burkhardt et al.
patent: 5241025 (1993-08-01), Hlatky et al.
patent: 5242876 (1993-09-01), Shamshoum et al.
patent: 5402321 (1995-03-01), Izu et al.
patent: 5455741 (1995-10-01), Wai et al.
Gutierrez Aurelio J.
Lint James D.
Renteria Victor H.
Kozma Thomas J.
Pulse Engineering
LandOfFree
Through-hole interconnect device with isolated wire-leads and co does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Through-hole interconnect device with isolated wire-leads and co, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Through-hole interconnect device with isolated wire-leads and co will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-508974