Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2002-06-24
2004-05-11
Cuneo, Kamand (Department: 2827)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S262000, C174S266000, C361S760000, C361S761000
Reexamination Certificate
active
06734373
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a through hole insertion type electronic component which is to be inserted into a through hole of a printed wiring board, and to a method of packaging the same.
2. Description of the Related Art
As one method of high density packaging, a method of inserting a component ink a through hole of a circuit board having printed wirings formed on both surfaces thereof, is disclosed in Unexamined Japanese Patent Application KOKAI Publication No. S63-119213.
The packaging method disclosed in this publication will be explained below with reference to
FIGS. 12A
to
12
C.
As illustrated in a cross section in
FIG. 12A
, a chip component
54
is placed in a through hole
53
of a wiring board
51
. An upper electrode
55
and lower electrode
56
of the chip component
54
are made of an elastic material having conductivity, and respectively have radial connector terminals
58
and
59
as shown in plan views in FIG.
12
B and FIG.
12
C.
The radial connector terminal
58
of the upper electrode
55
is electrically connected to a conductive pattern
52
formed on one surface of the wiring board
51
, by solder dip
57
. The radial connector terminal
59
of the lower electrode
56
is electrically connected to the conductive pattern
52
formed on the other surface of the wiring board
51
, by the solder dip
57
. The chip component
54
is held in the through hole by the elasticity of the upper electrode
55
and the lower electrode
56
.
The above conventional packaging technique has the following problems.
(1) The radial connector terminals
58
and
59
of the electrodes of the chip component
54
need to be connected to the conductive pattern
52
of the double side multi-layer wiring board by solder. However, it is difficult to connect the elastic radial connector terminals
58
and
59
to the conductive pattern
52
of the wiring board
51
by solder. Thus, a lot of time and efforts are required in the soldering process.
(2) A chip component having two electrodes can be packaged with ease, However, packaging of a chip component having three electrodes is structurally difficult.
SUMMARY OF THE INVENTION
The present invention has been made in consideration of the problems of the prior art, and an object of the present invention is to provide a through hole insertion type electronic component which is easy to package, and a method of packaging the same.
Another object of the present invention is to provide a through hole insertion type electronic component suitable for high density packaging with the use of an electronic component having three or more electrodes, and a method of packaging the same.
To solve the above described problems, a through hole insertion type electronic component according to a first aspect of the present invention is an electronic component to be inserted into a through hole of a multi-layer wiring board which comprises: the through hole; a through hole conductive film formed on an internal surface of the through hole; and n (n is an integer equal to or greater than 2) number of wiring patterns which are provided on different layers and connected to the through hole conductive film, the electronic component comprising:
n number of electrodes each of which is to be connected to a corresponding one of n number of electrodes of a chip component which is arranged in the through hole, and each of which contacts a corresponding position of the through hole conductive film; and
at least one blade which separates the through hole conductive film into n number of portions each of which is connected to a corresponding one of the n number of wiring patterns and to a corresponding one of the n number of electrodes.
The integer n may represent 2.
The electronic component may comprise: a first electrode component to be packaged on one surface of the multi-layer wiring board; and a second electrode component to be packaged on the other surface of the multi-layer wiring board.
The n number of electrodes may include; a first electrode which is provided to the first electrode component, and is electrically connected to a first electrode of the chip component arranged in the through hole and also contacts the through hole conductive film so as to electrically connect the first electrode of the chip component and the through hole conductive film to each other; and a second electrode which is provided to the second electrode component, and is electrically connected to a second electrode of the chip component arranged in the through hole and also contacts the through hole conductive film so as to electrically connect the second electrode of the chip component and the through hole conductive film to each other.
The blade may be provided to at least one of the first and second electrode components, and may separate the through hole conductive film into: a portion which is electrically connected to the first electrode and a first wiring pattern; and a portion which is electrically connected to the second electrode and a second wiring pattern.
The integer n may represent 3.
The electronic component may comprise: a first electrode component to be packaged on one surface of the multi-layer wiring board; and a second electrode component to be packaged on the other surface of the multi-layer wiring board.
The n number of electrodes may include: a first electrode which is provided to the first electrode component, and is electrically connected to a first electrode of the chip component arranged in the through hole and also contacts the through hole conductive film so as to electrically connect the first electrode of the chip component and the through hole conductive film to each other; a second electrode which is provided to the second electrode component, and is electrically connected to a second electrode of the chip component arranged in the through hole and also contacts the through hole conductive film so as to electrically connect the second electrode of the chip component and the through hole conductive film to each other; and a third electrode which is provided to one of the first electrode component and the second electrode component, and is electrically connected to a third electrode of the chip component arranged in the through hole and also contacts the through hole conductive film so as to electrically connect the third electrode of the chip component and the through hole conductive film to each other.
The blade may be provided to at least one of the first and second electrode components, and may separate the through hole conductive film into: a portion which is electrically connected to the first electrode and a first wiring pattern; a portion which is electrically connected to the second electrode and a second wiring pattern; and a portion which is electrically connected to the third electrode and a third wiring pattern.
The integer n may represent 4,
The electronic component may comprise: a first electrode component to be packaged on one surface of the multi-layer wiring board; and a second electrode component to be packaged on the other surface of the multilayer wiring board.
The n number of electrodes may include: a first electrode which is provided to the first electrode component, and is electrically connected to a first electrode of the chip component arranged in the through hole and also contacts the through hole conductive film so as to electrically connect the first electrode of the chip component and the through hole conductive film to each other; a second electrode which is electrically connected to a second electrode of the chip component arranged in the through hole and also contacts the through hole conductive film so as to electrically connect the second electrode of the chip component and the through hole conductive firm to each other; a third electrode which is provided to the second electrode component, and is electrically connected to a third electrode of the chip component arranged in the through hole and also contacts the through hole conductive film so as to electri
Cuneo Kamand
NEC Corporation
Patel I B
Sughrue & Mion, PLLC
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