Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Reexamination Certificate
2008-07-08
2008-07-08
Schillinger, Laura M (Department: 2813)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
C205S118000, C438S674000
Reexamination Certificate
active
07396447
ABSTRACT:
A method, structure and system for forming a through-hole conductor in a semiconductor substrate includes forming a hole having an inner surface from a first side of the semiconductor substrate to a second side of the semiconductor substrate and plating the inner surface of the semiconductor substrate to form a conductive element when a plating solution is forced from the first side of the semiconductor substrate to the second side of the semiconductor substrate through the hole. The hole is plated in a generally planar plating topology from the first side to the second side of the semiconductor substrate. The through-hole conductor may be formed in a plating system where the semiconductor substrate forms at least a partial partition between a higher pressure bath and a lower pressure bath with the plating solution passing through the hole causing plating within the inner surface of the hole.
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Micro)n Technology, Inc.
Schillinger Laura M
TraskBritt
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