Through-board electrical component header having integral solder

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit

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Details

29843, 2281801, 439857, H01R 909

Patent

active

047508892

ABSTRACT:
An electrical component for electrical interconnection of electrical elements includes an electrically non-conducting body containing at least one cavity for receiving an electrically conducting member, an opening for access to the cavity, a solder mask disposed proximate the opening for preventing the flow of molten solder through the opening and a frangible connection between the mask and the body. An electrical contacting member disposed within the cavity, preferably through a second opening, includes a solder tail that passes through the opening adjacent the mask. The component, containing the contacting member, is disposed on the top side of a printed circuit board with the solder tail, and preferably the mask, inserted into a plated-through hole in the board and protruding from the bottom side of the board. The solder tail is soldered to the board in a wave soldering process during which the mask prevents molten solder from entering the cavity. Thereafter, the solder mask may be removed by breaking the frangible connection so that an electrical lead can be inserted into the cavity from the bottom side of the board.

REFERENCES:
patent: 3059152 (1962-10-01), Khouri
patent: 3246386 (1966-04-01), Ende
patent: 3524960 (1970-08-01), Lohff
patent: 3525143 (1970-08-01), DeVito
patent: 3604836 (1971-09-01), Pierpont
patent: 3941444 (1976-03-01), Bruni et al.
patent: 3989331 (1976-11-01), Hanlon
patent: 4246627 (1981-01-01), Poensgen
patent: 4350856 (1982-09-01), Shiratori et al.
patent: 4373655 (1983-02-01), McKenzie
patent: 4645278 (1987-02-01), Yevak, Jr. et al.
Skip A Dip, Micro Electronic Systems, Inc.

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