Three-zone rapid thermal processing system utilizing wafer edge

Details Three-zone rapid thermal processing system utilizing wafer edge Three-zone rapid thermal processing system utilizing wafer edge

1992-12-29

1995-05-23

Jeffery, John A.

Electric resistance heating devices

Heating devices

Radiant heater

392411, 219390, 118724, 427557, F26B 1900, A21B 200, H01L 2100

Patent

active

054188857

ABSTRACT:
A three zone rapid thermal processing system includes three arrays of radiant heating lamps for heating a semiconductor wafer. The arrays are positioned along the axis of the wafer such that one array is adjacent one face of the wafer, the second array is adjacent the second face of the wafer and the third array is adjacent the edge of the wafer. A wafer holder holds the wafer face transverse to the common axis of the radiant heating lamps. Reflectors at each array reflect radiant heat onto the wafer. The arrays are independently connected to power sources and a controller to provide efficient coupling of the heat sources and a uniform temperature distribution across a wafer.

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