Three-wire-line vertical interconnect structure for multilevel s

Details Three-wire-line vertical interconnect structure for multilevel s Three-wire-line vertical interconnect structure for multilevel s

1995-11-06

1997-07-01

Gensler, Paul

Wave transmission lines and networks

Long line elements and components

Strip type

333247, 361790, H01P 500

Patent

active

056442777

ABSTRACT:
A vertical interconnect structure comprising a three-wire-line transmission line structure for providing electrical continuity between different levels of a multilevel substrate. The present invention provides a means for transferring power between various levels of the substrate without introducing excessive additional RE losses. First and second coplanar transmission line structures are disposed on first and second surfaces of the substrate. A vertical interconnect structure is disposed in the multilevel RF substrate and is coupled between the first and second transmission line structures. The vertical interconnect structure comprises three conductors having predetermined cross-sectional dimensions and predetermined separations therebetween that are adapted to transfer RE power between the first and second transmission line structures. In a completed electronic circuit employing the present invention, an electronic device is electrically coupled between two coplanar transmission line structures disposed on one surface of the substrate, and the vertical interconnect structure couples power to the electronic circuit by way of the coplanar transmission line structure disposed another surface of the substrate. The impedance of the vertical interconnect structure is determined by the relative dimensions of the three conductors and their relative separations. The three-wire-line transmission line structure supports a highly desirable TEM mode of energy propagation. The present invention is relatively easy to fabricate, in that vertical wires having a circular geometry are easily accommodated as part of the fabrication process for the substrate. The present invention provides for relatively low loss, because of the nature of the currents that flow on the conductors. The propagation characteristics are well-understood, and the vertical interconnect structure supports a highly desirable TEM mode of energy propagation.

REFERENCES:
patent: 3895435 (1975-07-01), Turner et al.
patent: 4543544 (1985-09-01), Ziegner
patent: 5057798 (1991-10-01), Moye et al.
patent: 5266912 (1993-11-01), Kledzik
patent: 5294897 (1994-03-01), Notani et al.
patent: 5424693 (1995-06-01), Lin
patent: 5552752 (1996-09-01), Sturdivant et al.

Affiliated with

Also associated with

Rating

Three-wire-line vertical interconnect structure for multilevel s does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Three-wire-line vertical interconnect structure for multilevel s, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Three-wire-line vertical interconnect structure for multilevel s will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-600646