Three wafer semiconductor pressure-difference sensor and method

Measuring and testing – Fluid pressure gauge – Diaphragm

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Details

73706, 29 2541, 3612834, G01L 1302

Patent

active

056231024

DESCRIPTION:

BRIEF SUMMARY
BACKGROUND OF THE INVENTION

The present invention is related to a method for manufacturing pressure-difference sensors having a semiconductor measurement diaphragm clamped between two bearing parts.
The European Patent Publication No. EP O 007 596 B1 ("the '596 publication") describes a pressure-difference sensor which has a semiconductor measuring diaphragm clamped, in insulated manner, between two bearing parts thereby forming an inner chamber in each case. Each of the two bearing parts holds a flat electrode on its inside. A first inner chamber is acted on, via a passage opening in the one bearing part, by a first pressure of the pressure difference to be measured. A second inner chamber is acted on by a second pressure of the pressure difference to be measured. The semiconductor measuring diaphragm and the flat electrodes are provided with external connections.
The pressure-difference sensor described in the '596 publication is developed such that its second inner chamber can also be acted on, via a passage opening in the corresponding bearing part, by the second pressure of the pressure difference to be measured. Thus, the pressure-difference sensor described in the '596 publication can detect a pressure difference in the traditional manner. However, the pressure-difference sensor of the '596 publication can also be used as a pressure measuring instrument by not providing a passage opening in the further bearing part, by forming the inner chamber with this further bearing parts and by evacuating the semiconductor measuring diaphragm or by connecting it with the outer air.
The object of the present invention is to provide a method for manufacturing a pressure-difference sensor having a semiconductor measuring diaphragm clamped between two bearing parts, each of the two bearing parts having flat electrodes and for creating the outer connectors for the semiconductor measuring diaphragm and the two flat electrodes in a relatively simple manner.


SUMMARY OF THE INVENTION

To achieve the aforementioned object, the present invention provides a method for the manufacture of pressure-difference sensors having a semiconductor measuring diaphragm clamped between two bearing parts thereby forming an inner chamber in each case. Each of the bearing parts holds a flat electrode on an inside surface. A first inner chamber is adapted to be acted on, via a passage opening in a first bearing part, by a first pressure of the pressure difference to be measured. A second inner chamber is adapted to be acted on by a second pressure of the pressure difference to be measured. The semiconductor measuring diaphragm and the flat electrodes are electrically connected with external connectors.
In the method of the present invention, which provides for the manufacture of pressure-difference sensors with external connectors on a free surface, a first wafer having several bearing parts, each of the bearing parts provided with a flat electrode having its own outer connection, is bonded with a second wafer having several semiconductor measuring diaphragms. A rectangular passage hole is present on one side of each of the semiconductor measuring diaphragms of the second wafer. By partial cuts through the second wafer, extending from the rectangular passage hole at an acute angle to its longitudinal direction, in each case, a web of the second wafer, lying adjacent to the rectangular passage hole, is insulated from the semiconductor measuring diaphragms. A third wafer having a plurality of further bearing parts, each provided with a flat electrode having its own outer connector, is bonded to the second wafer. The pressure-difference sensors are formed by means of separating cuts through the rectangular passage holes in their lengthwise direction and by separating cuts perpendicular thereto.
The method of the present invention advantageously permits several pressure-difference sensors of corresponding development to be produced in parallel. Moreover, the method of the present invention advantageously permits the manufacture the outer con

REFERENCES:
patent: 4073191 (1978-02-01), Saigusa
patent: 4261086 (1981-04-01), Giachino et al.
patent: 4495820 (1985-01-01), Shimada et al.
patent: 4612812 (1986-09-01), Broden
patent: 4831492 (1989-05-01), Kuisma
patent: 4996627 (1991-02-01), Zias et al.

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