Three-step plasma treatment of copper foils to enhance their lam

Details Three-step plasma treatment of copper foils to enhance their lam Three-step plasma treatment of copper foils to enhance their lam

1985-03-04

1986-05-13

Bueker, Richard

Stock material or miscellaneous articles

Composite

Of epoxy ether

428457, 428462, 4284735, 427 41, 1562726, B05D 306, B05D 510

Patent

active

045886415

ABSTRACT:
A three-step plasma treatment for improving the laminate adhesion of metallic and non-metallic substrates is described. The treatment comprises sequentially exposing the substrate to a first plasma of oxygen gas, a second plasma of a hydrocarbon monomer gas and a third plasma of oxygen gas. The process has particular utility in forming polymeric films on one or more surfaces of copper or copper alloy foils to be used in printed circuit applications.

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Shen et al., "A Review of Recent Advances in Plasma Polymerization", Plasma Polymerization, American Chemical Society, 1979, pp. 1-33.
Kominiak et al., Thin Solid Films 40, 141 (1977).

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