Three-step plasma treatment of copper foils to enhance their lam

Details Three-step plasma treatment of copper foils to enhance their lam Three-step plasma treatment of copper foils to enhance their lam

1983-11-22

1985-06-18

Bueker, Richard

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 39, 427 41, 4272556, 427299, 427327, 427331, 427377, 4273885, 4273882, B05D 306

Patent

active

045240892

ABSTRACT:
A three-step plasma treatment for improving the laminate adhesion of metallic and non-metallic substrates is described. The treatment comprises sequentially exposing the substrate to a first plasma of oxygen gas, a second plasma of a hydrocarbon monomer gas and a third plasma of oxygen gas. The process has particular utility in forming polymeric films on one or more surfaces of copper or copper alloy foils to be used in printed circuit applications.

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Kominiak et al., Thin Solid Films 40, 141, (1977).
Shen et al., "A Review of Recent Advances in Plasma Polymerization", Plasma Polymerization, Amer. Chem. Soc. 1979, 1.varies.33.

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