Three-dimensionally formed circuit sheet, component and...

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S643000, C257S645000, C257S647000, C257S679000, C438S725000, C361S679090

Reexamination Certificate

active

10983934

ABSTRACT:
A three-dimensionally formed circuit sheet comprises a resin film and a circuit pattern formed of an electrically conductive paste on the resin film. The electrically conductive paste contains, as a binder, a resin that is three-dimensionally formable. The resin film and the circuit pattern are formed in a three-dimensional shape. A method for manufacturing the three-dimensionally formed circuit sheet is also provided. The method comprises forming a circuit pattern on a resin film using an electrically conductive paste by means of printing, wherein the electrically conductive paste contains a resin that is three-dimensionally formable, and press molding the resin film including the circuit pattern into a three-dimensional shape. Additionally, a three-dimensionally formed circuit component comprising a three-dimensionally formed circuit sheet and a base member and a method for manufacturing the same are disclosed.

REFERENCES:
patent: 5233753 (1993-08-01), Wolf et al.
patent: 6380614 (2002-04-01), Higuchi et al.
patent: 6426143 (2002-07-01), Voss et al.
patent: 6537359 (2003-03-01), Spa
patent: 100 23 015 (2002-01-01), None
patent: 0 477 981 (1992-04-01), None
patent: 0 688 839 (1995-12-01), None
patent: 62-205687 (1987-09-01), None
patent: 6-188537 (1994-07-01), None
patent: 08-003502 (1996-01-01), None
patent: 09-129995 (1997-05-01), None
patent: 09-319068 (1997-12-01), None
patent: 2001-36240 (2001-02-01), None
patent: WO 01/86276 (2001-11-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Three-dimensionally formed circuit sheet, component and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Three-dimensionally formed circuit sheet, component and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Three-dimensionally formed circuit sheet, component and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3872440

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.