Stock material or miscellaneous articles – Three dimension imitation or 'treated' natural product
Patent
1996-02-09
1997-11-11
Epstein, Henry F.
Stock material or miscellaneous articles
Three dimension imitation or 'treated' natural product
428 33, 4285422, 434152, G09B 2506
Patent
active
056861540
ABSTRACT:
An improved three-dimensional topographical model comprised of a plurality of layers having curvilinear apertures therethrough. The layers are stacked upon each other to form a three-dimensional hollow structure. The individual layers are cut from at least two motherboards and each layer is marked with a contour line to indicate the location on which the subsequent layer is stacked. During assembly, the outermost topographical layer of a first motherboard is removed and placed on a support member, thus constituting the first or bottom layer of the model. The outermost topographical layer of the second motherboard is removed and placed on top of the first layer, and subsequent layers are alternately removed from each of any remaining motherboards and stacked so that the margin of each layer overlaps the margin of the previous layer. This process is repeated until all layers are utilized and the model is fully formed. A model having steep inclines will require a greater number of motherboards. During disassembly of the model, the layers are placed back into the relative motherboards from whence they came. This results in relatively flattened motherboards which can be conveniently stored or transported.
REFERENCES:
patent: 2127546 (1938-08-01), Whittier
patent: 2138024 (1938-11-01), Cheesman
patent: 2185689 (1940-01-01), Jensen
patent: 2189592 (1940-02-01), Perera
patent: 2687033 (1954-08-01), Snyder
patent: 2887791 (1959-05-01), Garbutt
patent: 3137080 (1964-06-01), Zang
patent: 3742620 (1973-07-01), Knoll
patent: 3800442 (1974-04-01), Petrocelli
patent: 5015312 (1991-05-01), Kinzie
patent: 5330804 (1994-07-01), Allison et al.
LandOfFree
Three-dimensional topographical model does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Three-dimensional topographical model, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Three-dimensional topographical model will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1227126