Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-07-05
2011-07-05
Pape, Zachary M (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S709000, C361S679520, C165S080400, C165S080500, C165S104330, C257S715000, C257S722000, C257SE23088, C174S015200
Reexamination Certificate
active
07974096
ABSTRACT:
The present disclosure relates to heat transfer thermal management device utilizing varied methods of heat transfer to cool a heat generating component from a circuit assembly or any other embodiment where a heat generating component can be functionally and operatively coupled. In a proposed embodiment, at least one heat pipe is used to transfer heat from the condensation portion of a vapor chamber to cool a bottom portion of a finned heat dissipation space and transfer the heat to a colder location on the heat fins. In another proposed embodiment, the water vapor chamber is placed in a heat sink and is adapted to thermally connect to at least one heat pipe.
REFERENCES:
patent: 4145708 (1979-03-01), Ferro et al.
patent: 4523636 (1985-06-01), Meijer et al.
patent: 5198889 (1993-03-01), Hisano et al.
patent: 5216580 (1993-06-01), Davidson et al.
patent: 5386143 (1995-01-01), Fitch
patent: 5704416 (1998-01-01), Larson et al.
patent: 5848637 (1998-12-01), Lee
patent: 6062302 (2000-05-01), Davis et al.
patent: 6181556 (2001-01-01), Allman
patent: 6237223 (2001-05-01), McCullough
patent: 6394175 (2002-05-01), Chen et al.
patent: 6410982 (2002-06-01), Brownell et al.
patent: 6490160 (2002-12-01), Dibene, II et al.
patent: 6550531 (2003-04-01), Searls et al.
patent: 6650544 (2003-11-01), Lai
patent: 6745824 (2004-06-01), Lee et al.
patent: 6863119 (2005-03-01), Sugito et al.
patent: 6882051 (2005-04-01), Majumdar et al.
patent: 6910794 (2005-06-01), Rice
patent: 6910796 (2005-06-01), Bailey et al.
patent: 6978829 (2005-12-01), Lin
patent: 7269014 (2007-09-01), Zhao et al.
patent: 7278470 (2007-10-01), Xia et al.
patent: 7327576 (2008-02-01), Lee et al.
patent: 7370693 (2008-05-01), Lin
patent: 7382047 (2008-06-01), Chen et al.
patent: 2002/0021556 (2002-02-01), Dibene, II et al.
patent: 2002/0056908 (2002-05-01), Brownell et al.
patent: 2002/0118511 (2002-08-01), Dujari et al.
patent: 2003/0164289 (2003-09-01), Weihs et al.
patent: 2004/0165350 (2004-08-01), Fan
patent: 2004/0174651 (2004-09-01), Aisenbrey
patent: 2005/0028965 (2005-02-01), Chen
patent: 2005/0051607 (2005-03-01), Wang et al.
patent: 2005/0103476 (2005-05-01), Chen et al.
patent: 2005/0123766 (2005-06-01), Anspach et al.
patent: 2005/0173098 (2005-08-01), Connors
patent: 2006/0037738 (2006-02-01), Li et al.
patent: 2006/0144574 (2006-07-01), Rosenfeld et al.
patent: 2006/0196640 (2006-09-01), Siu
patent: 2008/0043438 (2008-02-01), Refai-Ahmed
patent: 202005017349 (2006-01-01), None
patent: 2006033875 (2006-03-01), None
Levin, J., “Room Temperature Soldering of Connectors to PCB Using Reactive Multilayer Foils,” [2005], N.P.
“MCHX Technology,” N.D., N.P.
“Advancing Industrial Joining with Nanotechnology,” Reactive NanoTechnologies, N.D., Hunt Valley, ND.
“Innovative Fluidics Thermal Management Solutions,” downloaded from www.innovativefluidics.com on Aug. 17, 2006.
“Breakthrough Superlattice Technology,” downloaded from www.nextremetheremal.com on Aug. 17, 2006.
“Refined Cooling for Video Cards, pts. 1 and 2” downloaded from www.digit-life.com on Aug. 17, 2006.
Van Heerden, D. et al.; “A Tenfold Reduction in Interface Thermal Resistance for Heat Sink Mounting”; IMPAS Symposium; 2003.
International Search Report; European Patent Office; for International Application No. PCT/IB2007/002351; dated Jan. 16, 2008.
ATI Technologies ULC
Pape Zachary M
Vedder Price P.C.
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