Plastic and nonmetallic article shaping or treating: processes – Direct application of electrical or wave energy to work – Forming articles by uniting randomly associated particles
Reexamination Certificate
2002-02-12
2008-11-25
Tentoni, Leo B (Department: 1791)
Plastic and nonmetallic article shaping or treating: processes
Direct application of electrical or wave energy to work
Forming articles by uniting randomly associated particles
C264S113000, C264S463000
Reexamination Certificate
active
07455804
ABSTRACT:
A process for forming a three-dimensional article in sequential layers in accordance with a digital model of the article. The process comprises the steps of defining a layer of powder material, applying a liquid reagent to the powder layer in a pattern corresponding to the digital model, and repeating these steps to form successive layers. The powder comprises a first reactive component and the liquid includes a second active component capable of reacting with the first reactive component so that the article is built up in layers.
REFERENCES:
patent: 5204055 (1993-04-01), Sachs et al.
patent: 5340656 (1994-08-01), Sachs et al.
patent: 5466751 (1995-11-01), Gutweiler et al.
patent: 5902441 (1999-05-01), Bredt et al.
patent: 6363606 (2002-04-01), Johnson, Jr. et al.
patent: 6375874 (2002-04-01), Russell et al.
patent: 6742456 (2004-06-01), Kasperchik et al.
patent: 2001/0045678 (2001-11-01), Kubo et al.
patent: 2001/0050031 (2001-12-01), Bredt et al
patent: 2002/0106584 (2002-08-01), Lawton et al.
patent: 2006/0208388 (2006-09-01), Bredt et al.
patent: 63149112 (1988-06-01), None
patent: WO 98/56566 (1998-12-01), None
patent: WO 00/26026 (2000-05-01), None
patent: WO 01/34371 (2001-05-01), None
U.S. Appl. No. 60/164,000, filed Nov. 5, 1999, “Material Systems and Methods of Three-Dimensional Printing,” James Bredt et al.
Patel Ranjana
Peace Richard J.
Powell Jeremy
Rhodes Michael
Zhao Yong
Huntsman Advanced Materials Americas Inc.
Tentoni Leo B
LandOfFree
Three-dimensional structured printing does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Three-dimensional structured printing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Three-dimensional structured printing will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4026188