Three-dimensional structure and its manufacturing method

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices

Reexamination Certificate

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C310S340000, C310S345000

Reexamination Certificate

active

07825567

ABSTRACT:
A plurality of micro three-dimensional structure elements each having a movable structure fixed on a sacrifice layer, and fixation portions of the micro three-dimensional structure elements for the sacrifice layer are arranged into a film-like elastic body, and then the sacrifice layer is removed. Thus, a three-dimensional structure in which the individual micro three-dimensional structure elements are arranged independently of one another within the elastic body is manufactured.

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patent: 2005/0262676 (2005-12-01), Kim et al.
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patent: 2006-208248 (2006-08-01), None
Kentaro Noda, Kazunori Hoshino, Kiyoshi Matsumoto, Isao Shimoyama, “300nm-thick cantilevers in PDMS for tactile sensing”, Proc. IEEE MEMS'05, pp. 283-286, 2005.
Kentaro Noda et al., “Fabrication of the Flexible Sensor Using SOI Wafer by Removing the Thick Silicone Layer”, Category 3, Fabrication and Packaging Technologies, Reference No. 0857, Jan. 22, 2006.

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